ASMLActive
Deep-ultraviolet immersion and dry scanners - the workhorses that pattern the large majority of layers on every chip made, from leading-edge logic to mature automotive nodes. The flagship NXT:2100i immersion system runs 295 wafers per hour; 279 DUV systems were recognized in 2025.
Latest update Aug 30, 2026
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Shipping at scale; the bipartisan MATCH Act (S.4281), which would go further than existing export controls by banning both DUV immersion exports and the servicing of already-installed tools in China, remains stalled in Congress - the Senate NDAA it was expected to ride via a manager's amendment failed to advance on a July 14, 2026 procedural vote after Senate Democrats blocked it in an unrelated dispute over Iran-war funding, leaving the bill's floor path uncertain even after the House passed its own NDAA (with the MATCH Act's House companion H.R.8170) in July. Congress has been overtaken by direct executive action: an August 20, 2026 report said the US government is now preparing to pressure the Dutch government bilaterally to force a near-total ban on ASML's DUV sales and servicing to China, with an August 25, 2026 TrendForce report saying this could extend to tools already installed - the segment's biggest financial exposure regardless of which track (legislative or diplomatic) ultimately moves first
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The 0.33 NA extreme-ultraviolet scanners that are the only tools on Earth capable of patterning leading-edge chips from 7nm down to 2nm. The latest NXE:3800E runs 220 wafers per hour - 37% faster than its predecessor - at roughly $180M per machine; 48 EUV systems were recognized in 2025 revenue.
The 0.55 NA anamorphic-optics scanners for sub-2nm chipmaking - at ~$380M each, the most expensive production tools ever built. The production-grade EXE:5200B installed at Intel in Q4 2025 for the 14A node; on July 15, 2026 select layers of Intel's Panther Lake (18A) chips became the first High-NA-patterned product to reach high-volume manufacturing. On September 8, 2026 Intel Foundry and ASML said more than one million wafers had been processed on High-NA tools across certification, R&D and those Panther Lake layers. As of Semicon Taiwan 2026, 10 EXE systems were running at four customers with three more shipping, July fleet availability was 84% (90% Q4 target), and the qualified EXE:5200B had reached 135 wafers per hour in acceptance testing. TSMC said on September 8, 2026 that it intends to use High-NA in high-volume manufacturing from 2030.
An i-line (365nm) scanner for advanced 3D packaging and hybrid bonding - chiplet and HBM interposer work - that first shipped to a customer around Q3 2025 under new CTO Marco Pieters' push to expand ASML beyond lithography proper. At roughly 270 wafers per hour, it runs about 4x the throughput of ASML's prior packaging-focused tools, targeting demand from memory makers building HBM stacks for AI accelerators.
YieldStar optical metrology systems measure focus, dose, and overlay on exposed wafers, while HMI (Hermes Microvision) e-beam systems locate and analyze individual chip defects - together closing the litho control loop that keeps EUV and DUV scanners in spec. The latest YieldStar 10 extends in-line EUV metrology to sub-3nm nodes, and the HMI eP5 is ASML's highest-resolution e-beam system for defect detection and CD metrology.
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SpaceX
Partially reusable two-stage medium-lift launch vehicle. The world's most frequently launched orbital rocket.
SpaceX
Heavy-lift launch vehicle consisting of a strengthened Falcon 9 core with two additional boosters.
SpaceX
Reusable spacecraft for cargo and crew transport to the International Space Station.
SpaceX
Fully reusable super-heavy-lift launch system designed for missions to the Moon, Mars, and beyond. V3 (Block 3) variant with Raptor 3 engines is the production version.