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ASML

PublicFounded 1984🇳🇱Veldhoven, Netherlands
CEO

Christophe Fouquet

Data verified as of Aug 30, 2026

Summary

ASML, founded in 1984 as a Philips/ASM International joint venture that built its first machine in a shed in Eindhoven, is the world's dominant supplier of photolithography systems (~83% of the market) and the only company on Earth that makes EUV machines - the $180M-$400M tools without which no leading-edge chip can be manufactured. That monopoly has made the Veldhoven company one of Europe's most valuable tech firms (~$601B, July 2026, down from ~$693B in July after a China-competition scare - see below). 2025 revenue reached €32.7B with a record €13.2B in Q4 bookings and a €38.8B year-end backlog (ASML has since stopped disclosing quarterly bookings), and after twice raising 2026 guidance during the year - most recently at Q2 2026 to €43-45B - CEO Christophe Fouquet says chip demand is outpacing supply, with 65 low-NA EUV systems planned for 2026, rising toward 80-85 in 2027. The next act is High-NA EUV: the first EXE:5000 shipped to Intel in December 2023, the production-grade EXE:5200B arrived at Intel in Q4 2025 for its 14A node (risk production still targeted 2027), and on July 15, 2026 Intel became the first company to ship a high-volume commercial product patterned with High-NA EUV - select layers of its Panther Lake (Core Ultra Series 3, 18A) chips are now dual-qualified for either 0.33 NA or 0.55 NA scanners. Samsung, SK hynix and imec also hold early High-NA systems - fewer than a dozen exist worldwide, at roughly $380M each - but Samsung is reportedly holding its units back from mass production to contain foundry costs. TSMC, by contrast, has ruled out High-NA through its A16, A14, A13 and A12 nodes (production planned through 2029), citing cost - a real demand risk for ASML's most expensive tool. ASML also made an uncharacteristic strategic bet in September 2025, investing €1.3B to become the largest shareholder (~11%) of French AI lab Mistral AI. The main headwind is geopolitics: China was 33% of 2025 sales and held at roughly 20% of net sales through Q2 2026 under expanding US and Dutch export controls; a July 27, 2026 report that a state-linked Chinese entity has begun mass-producing a domestic immersion DUV tool (assessed as roughly equivalent to ASML's ~2008-era NXT:1950i, 15-18 years behind ASML's current platform) briefly knocked ASML shares down as much as 8%. Separately, US Commerce Secretary Howard Lutnick told senior ASML executives in a series of meetings beginning in April 2026 that Washington believes an EUV system or EUV-specific components may have reached China in breach of export controls - a claim ASML has categorically denied, backing its denial with an accounting of all 314 operational and 26 decommissioned EUV units worldwide by location; no formal enforcement action had been announced as of ASML's July 15, 2026 earnings call.

Company OverviewRead the long-form profile of ASML

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Main Products

EUV Lithography (TWINSCAN NXE)

The 0.33 NA extreme-ultraviolet scanners that are the only tools on Earth capable of patterning leading-edge chips from 7nm down to 2nm. The latest NXE:3800E runs 220 wafers per hour - 37% faster than its predecessor - at roughly $180M per machine; 48 EUV systems were recognized in 2025 revenue.

Shipping at scale - 65 low-NA EUV systems planned for 2026 on surging logic and DRAM demand, rising ~30% to 80-85 units in 2027

Throughput (NXE:3800E)220 wafers/hour (+37% vs NXE:3600D)
System price~$180M (NXE:3800E)
2025 EUV revenue€11.6B (+39%, 48 systems)
High-NA EUV (TWINSCAN EXE)

The 0.55 NA anamorphic-optics scanners for sub-2nm chipmaking - at ~$380M each, the most expensive production tools ever built. The production-grade EXE:5200B (175 wafers/hour, ~60% faster than the EXE:5000) installed at Intel in Q4 2025 for the 14A node; on July 15, 2026 select layers of Intel's Panther Lake (18A) chips became the first High-NA-patterned product to reach high-volume manufacturing. Samsung, SK hynix, and imec hold the rest of a worldwide fleet still under a dozen systems; TSMC has ruled out High-NA through 2029.

High-volume validation achieved via Intel Panther Lake (18A, Jul 2026); Intel 14A risk production in 2027 is the next insertion; Samsung reportedly holding its units back from mass production on cost grounds; TSMC has ruled out adoption through its A16/A14/A13/A12 nodes (production planned through 2029)

Throughput (EXE:5200B)175 wafers/hour (~60% above EXE:5000)
System price~$380M ($350–400M installed)
Fleet<12 systems worldwide (early 2026)
DUV Lithography (TWINSCAN NXT)

Deep-ultraviolet immersion and dry scanners - the workhorses that pattern the large majority of layers on every chip made, from leading-edge logic to mature automotive nodes. The flagship NXT:2100i immersion system runs 295 wafers per hour; 279 DUV systems were recognized in 2025.

Shipping at scale; the bipartisan MATCH Act (S.4281), which would go further than existing export controls by banning both DUV immersion exports and the servicing of already-installed tools in China, remains stalled in Congress - the Senate NDAA it was expected to ride via a manager's amendment failed to advance on a July 14, 2026 procedural vote after Senate Democrats blocked it in an unrelated dispute over Iran-war funding, leaving the bill's floor path uncertain even after the House passed its own NDAA (with the MATCH Act's House companion H.R.8170) in July. Congress has been overtaken by direct executive action: an August 20, 2026 report said the US government is now preparing to pressure the Dutch government bilaterally to force a near-total ban on ASML's DUV sales and servicing to China, with an August 25, 2026 TrendForce report saying this could extend to tools already installed - the segment's biggest financial exposure regardless of which track (legislative or diplomatic) ultimately moves first

Throughput (NXT:2100i)295 wafers/hour
2025 DUV revenue€12.0B (279 systems, 47% immersion)

An i-line (365nm) scanner for advanced 3D packaging and hybrid bonding - chiplet and HBM interposer work - that first shipped to a customer around Q3 2025 under new CTO Marco Pieters' push to expand ASML beyond lithography proper. At roughly 270 wafers per hour, it runs about 4x the throughput of ASML's prior packaging-focused tools, targeting demand from memory makers building HBM stacks for AI accelerators.

Shipping to early customers; a new, smaller growth line alongside EUV and DUV

Throughput (XT:260)~270 wafers/hour (~4x prior packaging tools)

YieldStar optical metrology systems measure focus, dose, and overlay on exposed wafers, while HMI (Hermes Microvision) e-beam systems locate and analyze individual chip defects - together closing the litho control loop that keeps EUV and DUV scanners in spec. The latest YieldStar 10 extends in-line EUV metrology to sub-3nm nodes, and the HMI eP5 is ASML's highest-resolution e-beam system for defect detection and CD metrology.

The smallest of ASML's four product lines by revenue (~€1B in 2025) but a growing area of R&D investment as shrinking nodes make yield control harder

2025 metrology & inspection revenue~€1B (remainder of system sales after EUV, DUV, and Installed Base Management)

What's Next

Deliver the twice-raised 2026 guidance: €43-45B

After €9.3B of Q2 net sales beat guidance on July 15, 2026, ASML lifted full-year 2026 sales guidance to €43-45B and gross margin to 54-56%, up from the April range of €36-40B, citing robust logic and memory demand and order momentum extending into 2027-2028. It guided Q3 net sales of €11-12B - the cleanest yearly test of whether AI-driven equipment demand holds.

Year-end 2026

imec qualifies the EXE:5200 for sub-2nm

imec's EXE:5200 - installed since March 2026 in its Leuven cleanroom, one of fewer than a dozen High-NA tools worldwide - continues toward sub-2nm process qualification, still targeted for Q4 2026, de-risking High-NA recipes for the whole industry.

Q4 2026

First High-NA production insertion: Intel 14A risk production

Intel's 14A node is the first process natively built around High-NA EUV, with risk production slated for 2027 and high-volume manufacturing in 2027-2028. Intel already dual-qualified select Panther Lake (18A) layers on High-NA in July 2026 as an interim validation step; ASML plans 80-85 low-NA EUV systems for 2027 alongside the High-NA ramp.

2027

Win High-NA demand beyond Intel as TSMC and Samsung defer mass-production adoption

TSMC's April 2026 roadmap update ruled out High-NA EUV for every node through A16, A14, A13, and A12 (production planned through 2029), citing the tool's roughly $380-400M cost, though CEO C.C. Wei confirmed in June 2026 that TSMC has purchased High-NA systems for R&D use and continues qualification work, with mass adoption more likely around the post-2029 A10 node. Samsung, which is reportedly holding its existing High-NA units back from mass production to contain foundry costs, is now said to be eyeing High-NA adoption for its 1nm process targeted around 2030 rather than sooner. Watch whether SK hynix, other memory makers chasing HBM capacity, or an earlier-than-expected TSMC or Samsung reversal provide the next demand catalyst.

2029-2030

Resolve the US Commerce Department's EUV-to-China shipment inquiry - and a broader push to force a Dutch DUV ban

Commerce Secretary Howard Lutnick told senior ASML executives in a series of meetings beginning in April 2026 that the US government believes an EUV system, or EUV-specific components, may have reached China in breach of export controls. ASML has categorically denied ever shipping an EUV machine or EUV-specific component to China and circulated a document in Washington accounting for all 314 operational and 26 decommissioned EUV units worldwide by location; as of this update no formal Bureau of Industry and Security enforcement action had been announced. That original inquiry has since been overtaken by a broader escalation: an August 20, 2026 report said Washington is preparing to pressure the Dutch government directly to force a near-total ban on ASML's DUV (not just EUV) sales and servicing to China, running on a separate diplomatic track from the stalled congressional MATCH Act (S.4281, introduced April 2026), which would itself ban DUV sales and servicing in China and give the Netherlands and Japan a 150-day deadline to match US export controls or face unilateral US Foreign Direct Product Rule enforcement against ASML. That bill's expected vehicle - a manager's amendment to the Senate FY2027 NDAA, advanced 18-9 by the Senate Armed Services Committee on June 10, 2026 - stalled on an unrelated July 14, 2026 procedural vote; Dutch Trade Minister Sjoerd Sjoerdsma formally protested the extraterritorial provisions and lobbied Lutnick and Congress in Washington in late June 2026, though one August analysis called the odds of the Netherlands blocking the push 'slim' given bipartisan Senate support. A full Senate floor debate on the FY2027 NDAA - and with it the first real signal on whether the MATCH Act rider survives - is plausible in September 2026. The February 2026 $252.5M BIS settlement with Applied Materials over a comparable violation remains the closest recent precedent for what a finding against ASML could cost.

September 2026 (possible Senate NDAA floor vote)

Hyper-NA EUV (0.75 NA) for sub-1nm nodes

ASML's next optical leap, an 0.75 NA platform (the 'HXE' series) aimed at the A7 and A5 nodes, targets the early 2030s; ASML and imec have confirmed the platform's feasibility, alongside a demonstrated next-generation EUV light source that could lift chip output 50% by decade's end - the projects that would extend the monopoly another decade.

Early 2030s

Nikon and Canon test ASML's edges: an ArF price war and a nanoimprint memory push

ASML's EUV monopoly is unthreatened, but its mature-node dominance is seeing its first real competitive pressure in years. Under new CEO Yasuhiro Ohmura (announced late May 2026), Nikon is undercutting ASML's roughly $82.5M average price on argon-fluoride (ArF) immersion DUV scanners to win back share it lost over the past decade, leaning on in-house component manufacturing to do it, and has a next-generation ASML-compatible ArF immersion platform planned for fiscal 2028. Separately, Canon is pushing nanoimprint lithography (NIL) tools, already installed at the Texas Institute for Electronics, at NAND memory and specialty-logic wafers that ASML does not prioritize rather than competing head-on in EUV. Neither approach threatens ASML's leading-edge business, but a marquee memory customer qualifying Canon's NIL for production, or Nikon's 2028 platform actually winning fabs back, would be the first crack in ASML's mature-node share in years - worth watching alongside the China export-control fight, since both rivals stand to gain most from any Chinese fabs pushed toward alternative suppliers.

FY2028 (Nikon's next ArF platform)

Track Record

3 of 4 announced dates hit · 1 missed

TSMC adopts High-NA EUV at its A14 node

Target ~2028 · Resolved Apr 23, 2026

TSMC's April 2026 process roadmap update ruled out High-NA EUV for every node through A16, A14, A13, and A12 (production planned through 2029), with SVP Kevin Zhang citing the tool's cost - the anticipated A14 adoption is no longer expected.

Missed

2025 total net sales of €30–35B

Target Year-end 2025 · Resolved Jan 28, 2026

FY2025 closed at €32.7B (+~16% YoY), inside the €30–35B guidance range given in October 2024, with a record €13.2B in Q4 bookings on top.

Hit

Ship the first second-generation High-NA (EXE:5200) in 2025

Target 2025 · Resolved Dec 31, 2025

The first EXE:5200 shipment was confirmed in July 2025, and the production-grade EXE:5200B shipped and installed at Intel in Q4 2025, with two High-NA systems recognized in Q4 revenue.

Hit

Ship the first High-NA EUV system by end of 2023

Target End of 2023 · Resolved Dec 21, 2023

The first TWINSCAN EXE:5000 shipped to Intel on December 21, 2023, meeting the long-promised 2023 delivery window for the industry's first High-NA system - it arrived in Oregon in 250 crates the following month.

Hit

Operations & Revenue

StatusOperational - record backlog, guidance raised, High-NA validated in high-volume production

Q2 2026 revenue was €9.3B at a 54.0% gross margin with €2.9B net income, and ASML again raised full-year guidance - to €43–45B, up from €36–40B - as AI-driven demand pushed customers to pull capacity plans forward, helped by a record €6.86B EUV order from SK hynix earlier in July. CEO Christophe Fouquet said ASML plans to ship 65 low-NA EUV systems in 2026, rising ~30% to 80-85 in 2027 (with a possible further 30% in 2028), alongside a roughly 30% increase in DUV immersion capacity to about 169-170 units for 2027, guiding Q3 to €11–12B on top of a multi-year backlog (ASML stopped disclosing a quarterly bookings figure starting Q1 2026). The High-NA ramp reached a milestone on July 15, 2026 when Intel became the first company to ship a high-volume commercial product - select Panther Lake (18A) layers - patterned with High-NA EUV, a full node ahead of the still-pending Intel 14A risk-production insertion; Samsung, SK hynix and imec also hold early High-NA systems, though Samsung is reportedly holding its units back from mass production to contain foundry costs, and TSMC has ruled out High-NA adoption through its A16/A14/A13/A12 nodes (production planned through 2029) on cost grounds - a real demand risk for ASML's priciest tool. ASML has also reportedly begun pushing for higher tool prices (a 10% hike on mature DUV tools already agreed with some Chinese customers), with TSMC pushing back on both EUV and DUV increases. Key risks: China revenue held at roughly 20% of sales through Q2 2026 under expanding US and Dutch export controls (with new US congressional proposals targeting even DUV servicing in China); the July 27, 2026 report that state-backed Shanghai Yuliangsheng Technology has begun mass-producing a domestic immersion DUV tool for SMIC, Hua Hong, and CXMT (about 5 units in 2026, ~20 more planned for 2027, assessed as roughly equivalent to ASML's ~2008-era NXT:1950i) sent ASML shares down as much as 8% intraday even though the Chinese tool reportedly still trails ASML's current platform by 15-18 years; an unresolved US Commerce Department inquiry, first raised by Secretary Howard Lutnick with ASML executives in April 2026, into whether an EUV system or EUV-specific components reached China in breach of export controls - which ASML denies and for which no enforcement action has been announced - remains a headline risk given the $252.5M BIS settlement Applied Materials paid in February 2026 for a comparable violation; that inquiry has since been joined by a broader escalation reported August 20, 2026, in which Washington is preparing to pressure the Dutch government to force a near-total ban on ASML's DUV (not just EUV) sales and servicing to China outside the congressional MATCH Act process, which itself remains stalled after the Senate NDAA it was expected to ride failed a July 14, 2026 procedural vote in an unrelated dispute; and the industry's inherent cyclicality should AI capex correct. ASML continued daily share buybacks through late August 2026 (roughly €77-79M/day, Aug 17-21) even as its market cap eased from a mid-August peak amid the renewed China-policy uncertainty.

Revenue Streams

EUV systems (NXE + EXE)

0.33 NA and High-NA extreme-ultraviolet scanners - €11.6B in 2025 (+39%, 48 systems), roughly 35% of revenue and growing fastest as every leading-edge logic and DRAM fab expands.

DUV systems (TWINSCAN NXT/XT)

Deep-ultraviolet immersion and dry scanners that pattern the majority of layers on every chip - €12.0B in 2025 (279 systems), with China exposure making this the stream most affected by export controls.

Installed Base Management (service & upgrades)

Service contracts, spares, software, and performance upgrades across the global fleet - €8.2B in 2025 (~25% of revenue), the recurring stabilizer that keeps growing even in downturns (€2.5B in Q1 2026 alone).

Metrology & inspection

YieldStar optical metrology and HMI e-beam inspection systems that close the litho control loop - the remaining ~€1B of 2025 sales.

Key Metrics

Employees

44,500+ FTE (as of Jun 28, 2026)

Est. Annual Revenue

€32.7B (FY2025); 2026 guided to €43–45B (raised at Q2 2026)

EUV market share

100% - sole producer of EUV lithography machines

Overall lithography market share

~83% of worldwide system sales; sole producer of EUV (100%)

2025 revenue

€32.7B (net income €9.6B; gross margin 52.8%)

Q2 2026 revenue

€9.3B (net income €2.9B; gross margin 54.0%); Q3 guided to €11–12B at 55–57% gross margin, results due October 14, 2026

Order backlog

€38.8B (end of 2025; record €13.2B Q4 bookings) - ASML stopped disclosing quarterly bookings from Q1 2026 onward, describing order intake only qualitatively as 'very strong'; plans a 30% increase in both 2027 low-NA EUV and DUV immersion capacity to meet it

Market cap

~$650-680B (Aug 28, 2026 close, ~$1,696/share) - continued softening from the ~$666-725B mid-August range amid the escalating China DUV-ban story

2025 systems delivered

48 EUV + 279 DUV revenue-recognized

High-NA fleet worldwide

~12+ systems (Intel x2, TSMC R&D unit, Samsung x2, SK hynix, imec), plus a new EXE:5200B still installing at Albany NanoTech (NY CREATES/IBM) as of late July 2026, with first light targeted by end of 2026

China revenue share

33% (2025); full-year 2026 guided ~20%, though Q2 2026 system sales to China specifically fell to 14% (down from 19% in Q1 2026 and 36% in Q4 2025)

Timeline

20262026 guidance raised to €36–40B on AI demand

Q1 2026 delivers €8.8B in sales at a 53% gross margin, and ASML raises full-year guidance from €34–39B to €36–40B - Fouquet: 'demand for chips is outpacing supply. Our customers are accelerating capacity expansion plans for 2026 and beyond.'

2026Intel ships first High-NA-patterned high-volume logic product

On July 15, 2026 ASML and Intel announce that select layers of Intel's Panther Lake (Core Ultra Series 3, 18A) chips are now dual-qualified for either 0.33 NA (NXE) or 0.55 NA (EXE) scanners and shipping to customers at yields matched to the existing EUV platform - the first time a High-NA-patterned product has reached high-volume manufacturing, a full node ahead of the previously flagged Intel 14A risk-production milestone.

2025€1.3B investment makes ASML Mistral AI's largest shareholder

On September 9, 2025, ASML leads Mistral's €1.7B Series C at a ~€11.7B valuation, taking ~11% and a board seat - an uncharacteristic strategic bet pairing Europe's chip champion with its leading AI lab.

2025First production High-NA ships; record Q4 bookings

The production-grade EXE:5200B ships and installs at Intel in Q4 2025 for the 14A node, with two High-NA systems recognized in revenue; Q4 net bookings hit a record €13.2B (€7.4B EUV) and FY2025 closes at €32.7B with a €38.8B backlog.

2024Christophe Fouquet becomes President & CEO

Fouquet, who joined ASML in 2008 and previously ran the EUV business, succeeds Peter Wennink in April 2024.

2023First High-NA EUV system ships to Intel

On December 21, 2023, ASML ships the industry's first High-NA system (TWINSCAN EXE:5000, 0.55 NA) to Intel in Oregon - it arrives in 250 crates - opening the sub-2nm era.

2017First production-ready EUV system ordered in volume

The NXE:3400 becomes the first EUV machine ordered in volume for production use, after two decades and billions of euros of development - the 100th EUV system ships in early 2020.

2013Acquires EUV light-source maker Cymer for $2.55B

ASML buys San Diego-based Cymer, vertically integrating the laser-produced-plasma light source that is EUV's hardest subsystem; e-beam metrology firm Hermes Microvision follows in 2016 for $3.1B.

2012Intel, TSMC, and Samsung co-fund EUV development

With EUV's cost threatening to sink it, ASML's three biggest customers buy in - Intel alone invests $4.1B for 15% - funding the decade-long push to make extreme-ultraviolet lithography work.

2001TWINSCAN dual-stage architecture launches

TWINSCAN exposes one wafer while measuring the next - a throughput breakthrough that remains the basis of every ASML system; the company also acquires Silicon Valley Group the same year.

1995IPO on Amsterdam and New York exchanges

ASML goes public, becoming fully independent as Philips divests over the following years - today it is dual-listed on Euronext Amsterdam and Nasdaq.

1991PAS 5500 breakthrough makes ASML profitable

The PAS 5500 platform wins key customers and turns the struggling venture profitable - the foundation of ASML's rise against then-dominant Japanese rivals Nikon and Canon.

1984Founded as a Philips/ASM joint venture - in a shed

ASM Lithography launches as a 50/50 joint venture of Philips and ASM International, building its first stepper (PAS 2000) in a shed next to a Philips office in Eindhoven.

Funding

RoundDateAmountInvestorsSource
Founding joint venture198450/50 JVPhilips and ASM International
IPO (Amsterdam + Nasdaq)Mar 1995IPOPublic markets; Philips divested over the following years
Customer co-investment program2012$4.1B from Intel alone (15% stake)Intel, TSMC, Samsung - funding EUV development

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SpaceX

Semiconductors

Space Exploration Technologies Corp. (SpaceX) designs, manufactures, and launches reusable rockets and spacecraft. The company operates Falcon 9, Falcon Heavy, Dragon, Starlink, and the government-focused Starshield line while continuing to develop Starship for high-cadence heavy-lift missions to the Moon, Mars, and beyond. Starlink crossed 12 million customers across 160+ countries on June 4, 2026 and the constellation now exceeds 10,400 working satellites in orbit. Following the February 2026 xAI merger, SpaceX also operates the Memphis Colossus supercomputers as an AI hyperscaler, disclosing $14.1B of new Cloud Services Agreements signed in Q2 2026 alone (on top of the Anthropic, Google, and Reflection AI compute deals). SpaceX completed the largest IPO in history on June 12, 2026, debuting on Nasdaq under ticker SPCX at its fixed $135-per-share price for a roughly $1.77 trillion valuation and about $75B in proceeds, with Elon Musk retaining ~82% voting control; SPCX slid as low as $107.01 in late July before rebounding to close above its $135 IPO price on August 10, 2026 for the first time since mid-July. Starship returned to flight after the FAA closed the Flight 12 mishap investigation on July 13, 2026: on July 24, 2026 Flight 13 - the second flight of the Version 3 vehicle - deployed the program's first 20 operational Starlink V3 satellites and made the softest ship splashdown yet, and recovery crews towed the intact upper stage (Ship 40) through rough seas to Christmas Island, Australia by August 18, 2026 - the first Starship upper stage ever recovered intact after flight - before the semi-submersible vessel Forte departed Christmas Island on August 28, 2026 to carry it roughly 20,000 km back to Starbase, Texas. Days after its IPO, SpaceX agreed on June 16, 2026 to acquire AI coding startup Cursor's parent Anysphere for $60B in an all-stock deal - the largest acquisition of a venture-backed startup ever - and closed the deal on August 15, 2026, ahead of its late-August target, giving Cursor access to SpaceX's GPU fleet including the Colossus supercomputer. SpaceX posted its first earnings as a public company on August 4, 2026 (Q2 revenue of $7.8B, up 92% year over year, narrowing its net loss to $541M), and on August 11 Elon Musk told employees SpaceX's AI compute business would exceed all its other revenue by September 2026 and account for 99% of the company's value within five years, targeting 10 gigawatts of AI compute capacity - up from 1.4 GW at the end of Q2 - by the end of 2027. On August 25 SpaceX announced a $100 billion Starbase Louisiana spaceport in Vermilion Parish, with construction expected in 2027 and a first launch targeted as soon as 2029. A Falcon Heavy flew its 13th mission on August 30, 2026, launching NASA's Roman Space Telescope with both side boosters landing intact at Cape Canaveral, a day after NASA and SpaceX postponed the planned September 12 Crew-13 ISS launch when an oxidizer leak was found in Dragon's propulsion system during prelaunch processing. A mid-August 13F filing also disclosed Nvidia holds roughly $21B of SpaceX stock via its earlier xAI investment, as SpaceX committed on its August 4 earnings call to building its future AI compute exclusively on Nvidia's Vera Rubin architecture. SPCX shares climbed about 7% to close at $150.84 on September 3, 2026 after Oppenheimer raised its price target to $280 from $250 on growing confidence in the AI-compute business, with investors also looking ahead to the approaching Starship Flight 14 test.

Tesla logo

Tesla

Semiconductors

Tesla is a vertically integrated automotive, energy storage, and AI company headquartered in Austin, Texas. After building its final Model S and Model X on May 10, 2026 and converting that Fremont line to Optimus, it now manufactures three consumer vehicles (Model 3, Model Y, Cybertruck), sells Full Self-Driving (Supervised) software, operates energy storage and solar businesses, runs an unsupervised Robotaxi service across seven US metros (Austin, Dallas, Houston, Miami, Orlando, and Tampa driverless, plus a supervised Bay Area pilot), and is ramping new products including Cybercab (in production at Giga Texas since Feb 2026; commercial paid rides began in Austin on September 3, 2026, the same day NHTSA opened audit AQ26002 on how Tesla self-certified the steering-wheel-free vehicle), Tesla Semi (now in a commissioning phase at the new Nevada line as it works toward a 50,000-unit/year target), and Optimus (entered production on Fremont's converted first-generation line around August 27-28, 2026, feeding an internal training program rather than customer sales; the V3 public reveal remains undated). In Q2 2026, Tesla generated a record $28.24B in revenue (+26% YoY) on 480,126 vehicle deliveries, though GAAP operating margin narrowed to 1.4% amid heavy AI, Optimus, and Robotaxi investment, and guided to over $25B of full-year 2026 capital expenditure; it had 1.48M active FSD subscriptions and operated 8,704 Supercharger stations.

TSMC logo

TSMC

Semiconductors

Taiwan Semiconductor Manufacturing Company, founded in Hsinchu in 1987 by Morris Chang, invented the dedicated-foundry business model and now dominates it utterly: 69.9% of the global foundry market in 2025, holding at roughly 73% through the first two quarters of 2026 (Counterpoint Research), with Samsung a distant second at 7%. It is effectively the sole manufacturer of leading-edge AI silicon - Nvidia, Apple, AMD, and Broadcom all fab their flagship chips there - which made it the primary beneficiary of the AI buildout: 2025 revenue hit a record $122.4B (+35.9%), and Q1 2026 revenue grew another 35.1% to $35.9B at a 66.2% gross margin, with high-performance computing now 61% of sales. Its N2 (2nm) node, the company's first gate-all-around process, entered volume production on schedule in Q4 2025 at Fab 22 in Kaohsiung, with the enhanced N2P variant due in H2 2026 and the A16 node (backside power delivery) now slated for 2027 after slipping from late 2026. TSMC raised its 2026 capex guidance to a record $60–64B in July 2026 - the largest capital budget in semiconductor history - while globalizing its footprint: Arizona's Fab 21 has produced 4nm chips at Taiwan-par yields since Q4 2024, and on its July 16 earnings call TSMC pledged roughly $100B more to expand the Arizona campus with at least four additional 2nm-and-below fabs, lifting its total US commitment to about $265B (the largest foreign direct investment in US history); Japan's JASM is building a second Kumamoto fab upgraded to 3nm, now targeted for 2028 after the upgrade pushed back its original late-2027 goal, and the Dresden ESMC fab targets production in late 2027. TSMC is also diversifying beyond logic: on August 10, 2026, it announced a ~$6.3B joint venture with Sony (Sony 60%/TSMC 40%) to build a Kumamoto image-sensor fab targeting 2029 mass production. A January 2026 US–Taiwan trade deal exempts TSMC from new 25% Section 232 semiconductor tariffs in proportion to its US buildout. The overhang remains geopolitical: the vast majority of its leading-edge capacity sits on Taiwan, at the center of US–China tension.

Varda Space Industries logo

Varda Space Industries

Semiconductors

Varda Space Industries manufactures materials in orbit and brings them back to Earth, a business no company had ever run commercially before it. Founded in 2021 by former SpaceX Dragon engineer Will Bruey and Founders Fund partner Delian Asparouhov, it builds the W-Series: free-flying spacecraft that process pharmaceuticals in microgravity and then return the product inside a capsule that reenters at over 18,000 mph and lands under parachute, usually at the Koonibba Test Range in South Australia. The commercial logic is that microgravity produces crystal structures and morphologies that gravity makes impossible on the ground, and Varda proved it on its first flight by growing and recovering the metastable Form III of ritonavir, an HIV antiviral. Six missions have flown since 2023, and five of the six capsules made it home; the fourth, W-4, spent nearly a year on orbit while Varda evaluated a propellant-feed problem before closing out the mission with a disposal burn in May 2026 rather than a recovery. W-5 returned in January 2026 as the first full mission on Varda's own vertically integrated satellite bus, carrying a U.S. Navy payload, and W-6 returned in May 2026 flying thermal-protection and autonomous-navigation experiments for NASA and defense customers under the AFRL's Prometheus program. That second business, selling the capsule as a cheap, high-cadence hypersonic reentry testbed, now runs alongside the pharmaceutical work, and in October 2025 Varda added a third line, agreeing with United Semiconductors to grow semiconductor crystals in microgravity for autonomous-systems, sensing, AI, and defense customers. In May 2026 United Therapeutics signed on to develop microgravity formulations for rare pulmonary disease, the first time a publicly traded pharmaceutical company has spent its own capital on commercial drug manufacturing in space, and Varda leased a former Mattel manufacturing plant in El Segundo in early 2026 to scale spacecraft production to match.