Advanced Packaging (TWINSCAN XT:260)

Overview

An i-line (365nm) scanner for advanced 3D packaging and hybrid bonding - chiplet and HBM interposer work - that first shipped to a customer around Q3 2025 under new CTO Marco Pieters' push to expand ASML beyond lithography proper. At roughly 270 wafers per hour, it runs about 4x the throughput of ASML's prior packaging-focused tools, targeting demand from memory makers building HBM stacks for AI accelerators.

Shipping to early customers; a new, smaller growth line alongside EUV and DUV

Key Specs