TSMC

On January 15, 2026, TSMC reports record 2025 revenue of $122.42B (+35.9%) with net income up 51.2%, and guides 2026 capex to $52–56B — the largest single-year capital budget in semiconductor history. The same day, a US–Taiwan trade deal exempts US-investing Taiwanese chipmakers from new Section 232 tariffs.

At the April 2026 North America Technology Symposium, TSMC lays out N2P and A16 (now 2027, from H2 2026), A14 next, and A12/A13 for 2029 — notably planned without ASML's High-NA EUV tools.

On July 16, 2026, TSMC reports second-quarter net profit of NT$706.6 billion (about US$22B), up 77% YoY to a record and far above the ~NT$632.6B analyst consensus, on record revenue of NT$1.27 trillion (+36% YoY). Demand for leading-edge N3/N5 nodes and advanced CoWoS packaging — reported sold out through year-end — kept capacity near full as the AI buildout continued.

On its July 16, 2026 earnings call, TSMC said it will invest roughly $100B more to expand its Arizona campus with at least four additional fabs for 2nm-and-below nodes, lifting its total planned US investment to about $265B — the largest foreign direct investment in US history. It also raised 2026 capital-spending guidance to a record $60–64B (from $52–56B), with 70–80% earmarked for advanced process technology, and expects ~30% of its 2nm-and-below capacity to eventually sit in the US.

On March 4, 2025, TSMC announces three more fabs, two advanced-packaging plants, and an R&D center in Arizona, lifting its total US commitment to $165B — the largest foreign direct investment in US history.

TSMC's first gate-all-around nanosheet node enters volume production in Q4 2025 at Fab 22 (Kaohsiung) and Fab 20 (Hsinchu), confirmed December 30, 2025 — with reported yields around 70% and a claimed 10–15% speed gain or 25–30% power cut versus N3E.

TSMC's Japanese joint venture with Sony, Denso, and Toyota opens its first fab in February 2024, producing 12–28nm chips — the anchor of Japan's semiconductor revival.

Phase 1 of Fab 21 begins high-volume 4nm (N4) production in Q4 2024 — TSMC's first US leading-edge output, with yields on par with Taiwan fabs and customers including Apple and Nvidia.

TSMC starts volume production of N3, the industry's most advanced node, extending its leadership through the generation that would power the first wave of AI accelerators.

Volume production of 5nm chips begins (Apple's A14 and M1 era), and TSMC announces its first US leading-edge fab in Phoenix, Arizona, with an initial $12B commitment.

TSMC becomes the first to high-volume 7nm production, seizing process leadership from Intel — a lead it has never relinquished. C.C. Wei becomes CEO the same year.

TSMC lists on the TWSE under ticker 2330, followed in 1997 by NYSE ADRs (TSM) — the first Taiwanese company to list on the NYSE.

TSMC is founded in Hsinchu with Taiwan's government providing 48.3% of the capital and Philips 27.6% ($58M) — the first semiconductor company to manufacture only other companies' chip designs, the business model that reshaped the industry.