TSMCActive
TSMC's 2nm-class node and its first with gate-all-around nanosheet transistors, delivering 10–15% more speed or 25–30% less power than N3E. Volume production began on schedule in Q4 2025 at Fab 22 (Kaohsiung) and Fab 20 (Hsinchu), with the enhanced N2P variant following in H2 2026 - the process powering the next generation of flagship smartphone and AI silicon.
Latest update Sep 15, 2026
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In volume production since Q4 2025 with reported yields around 70%; ramping through 2026 on smartphone and HPC demand, N2P due H2 2026. MediaTek on September 15, 2026 said its Dimensity 9600 Pro is its first smartphone chip on TSMC's 2nm node, with first phones expected this quarter.
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TSMC's 2.5D and 3D packaging technologies that integrate GPU dies with stacks of high-bandwidth memory on silicon interposers - the technology every leading AI accelerator depends on, and for two years the binding constraint on global AI chip supply. Capacity is being expanded roughly fourfold from late-2024 levels, including the new AP7 plant in Chiayi and two planned Arizona packaging facilities.
TSMC's US manufacturing site in Phoenix, now backed by a ~$265B commitment - the largest foreign direct investment in US history - after TSMC pledged another ~$100B on its July 16, 2026 earnings call to add at least four more 2nm-and-below fabs. Phase 1 has produced 4nm chips at Taiwan-par yields since Q4 2024 for customers including Apple and Nvidia; Phase 2 brings 3nm production, with equipment move-in from Q3 2026, pilot production in early 2027, and volume production targeted for Q3 2027 (pulled in about a year from the original plan); Phase 3, targeting N2 and A16, has broken ground for ~2029. TSMC expects ~30% of its 2nm-and-below capacity to eventually sit in the US.
TSMC's 1.6nm-class node combining gate-all-around nanosheets with Super Power Rail backside power delivery, targeting AI and HPC chips with 8–10% more speed or 15–20% less power than N2P. Volume production is now slated for 2027 after slipping from the original H2 2026 target; the follow-on A14, A12, and A13 nodes extend the roadmap to 2029 - all planned without High-NA EUV.
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SpaceX
Partially reusable two-stage medium-lift launch vehicle. The world's most frequently launched orbital rocket.
SpaceX
Heavy-lift launch vehicle consisting of a strengthened Falcon 9 core with two additional boosters.
SpaceX
Reusable spacecraft for cargo and crew transport to the International Space Station.
SpaceX
Fully reusable super-heavy-lift launch system designed for missions to the Moon, Mars, and beyond. V3 (Block 3) variant with Raptor 3 engines is the production version.