TSMC's board approved about $29.44 billion in capital appropriations for advanced-technology, packaging and fab construction at a meeting concluding August 11, and executed a legally binding definitive agreement with Sony Semiconductor Solutions to build the previously announced Kumamoto image-sensor joint venture. Sony will contribute about 465 billion yen and TSMC about 282 billion yen to the venture, which keeps its 60%/40% split and targets volume production of next-generation image sensors in 2029.
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