ASMLActive
YieldStar optical metrology systems measure focus, dose, and overlay on exposed wafers, while HMI (Hermes Microvision) e-beam systems locate and analyze individual chip defects - together closing the litho control loop that keeps EUV and DUV scanners in spec. The latest YieldStar 10 extends in-line EUV metrology to sub-3nm nodes, and the HMI eP5 is ASML's highest-resolution e-beam system for defect detection and CD metrology.
Latest update Aug 3, 2026
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The smallest of ASML's four product lines by revenue (~€1B in 2025) but a growing area of R&D investment as shrinking nodes make yield control harder
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The 0.33 NA extreme-ultraviolet scanners that are the only tools on Earth capable of patterning leading-edge chips from 7nm down to 2nm. The latest NXE:3800E runs 220 wafers per hour - 37% faster than its predecessor - at roughly $180M per machine; 48 EUV systems were recognized in 2025 revenue.
The 0.55 NA anamorphic-optics scanners for sub-2nm chipmaking - at ~$380M each, the most expensive production tools ever built. The production-grade EXE:5200B installed at Intel in Q4 2025 for the 14A node; on July 15, 2026 select layers of Intel's Panther Lake (18A) chips became the first High-NA-patterned product to reach high-volume manufacturing. On September 8, 2026 Intel Foundry and ASML said more than one million wafers had been processed on High-NA tools across certification, R&D and those Panther Lake layers. As of Semicon Taiwan 2026, 10 EXE systems were running at four customers with three more shipping, July fleet availability was 84% (90% Q4 target), and the qualified EXE:5200B had reached 135 wafers per hour in acceptance testing. TSMC said on September 8, 2026 that it intends to use High-NA in high-volume manufacturing from 2030.
Deep-ultraviolet immersion and dry scanners - the workhorses that pattern the large majority of layers on every chip made, from leading-edge logic to mature automotive nodes. The flagship NXT:2100i immersion system runs 295 wafers per hour; 279 DUV systems were recognized in 2025.
An i-line (365nm) scanner for advanced 3D packaging and hybrid bonding - chiplet and HBM interposer work - that first shipped to a customer around Q3 2025 under new CTO Marco Pieters' push to expand ASML beyond lithography proper. At roughly 270 wafers per hour, it runs about 4x the throughput of ASML's prior packaging-focused tools, targeting demand from memory makers building HBM stacks for AI accelerators.
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SpaceX
Partially reusable two-stage medium-lift launch vehicle. The world's most frequently launched orbital rocket.
SpaceX
Heavy-lift launch vehicle consisting of a strengthened Falcon 9 core with two additional boosters.
SpaceX
Reusable spacecraft for cargo and crew transport to the International Space Station.
SpaceX
Fully reusable super-heavy-lift launch system designed for missions to the Moon, Mars, and beyond. V3 (Block 3) variant with Raptor 3 engines is the production version.