Xring D100 (Smart-Driving Chip)

In Development
Xiaomi EV
Xiaomi EV

Overview

Xiaomi's first in-house smart-driving chip, built on a 3nm process and designed to run large AI models on-device for autonomous-driving decisions rather than relying on the cloud.

Unveiled August 24, 2026 alongside Xiaomi's Xring O3 and O100 smartphone chips; the D100 has completed validation and is manufactured by TSMC, with commercial deployment in vehicles targeted for 2027.

Key Specs

Process node

3nm

Compute architecture

20-core CPU, 16-core NPU, up to 160GB unified memory (supports on-device LLMs up to 200B parameters)

Target deployment

Commercial vehicle use in 2027