Tuesday, September 8, 2026
TSMC and Taiwan firms push silicon photonics alliance
Taiwan's Ministry of Economic Affairs said on September 6, 2026 that TSMC, ASE, MediaTek, Foxconn and about 30 other Taiwanese companies are working to complete a domestic silicon photonics supply chain for co-packaged optics, a theme that dominated Semicon Taiwan 2026 in Taipei. The ministry said moving chip-to-chip links from copper to light can cut power use by 30 to 50 percent and is meant to keep CPO design, manufacturing and packaging on the island. Herald Business, citing Taiwanese media, separately reported TSMC is targeting mass production of next-generation CoPoS packaging in the second half of 2028.
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