ServeTheHome reported on Nov. 2, and Futurum on Nov. 3, that Qualcomm has validated a first High Bandwidth Compute sample in San Diego. Both say the tested stack has two DRAM layers, while production parts are planned with four. Qualcomm's reported measurements put bandwidth at about 18 times external LPDDR5X and bandwidth per watt at more than 5 times published HBM4 specifications. Futurum says the workload was not disclosed and that the result is 5 to 6 times HBM4 depending on normalization. Futurum says Dragonfly AI250 sampling is expected in the first half of 2027. No Qualcomm newsroom post of the test was found.
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