Samsung breaks ground on an HBM packaging line in Asan

Samsung Electronics broke ground on Nov. 12, 2026 on Onyang Line 5, an HBM packaging facility at its Asan campus, targeting operations in June 2028, about a year earlier than previously planned. The Korea Times reported 46 trillion won for the Onyang lines, including 6 trillion won for construction and 40 trillion won for equipment, and a three-story cleanroom of about 31,000 square meters. The Korea Herald said the line is intended to package HBM4E, and both papers describe a 144 trillion won Chungcheong plan by Samsung and affiliates.