Samsung Electronics

HBM4

Shipping

Samsung's sixth-generation high-bandwidth memory. The Feb. 12, 2026 newsroom says mass production has begun and commercial products have shipped. Typical pin speed 11.7 Gbps, up to 13 Gbps; up to 3.3 TB/s per stack; 12-layer stacks from 24 GB to 36 GB, using 1c DRAM and a 4nm logic base die. HBM4E 12-layer samples began shipping May 29, 2026 at 14 Gbps typical (up to 16 Gbps) and 48 GB; mass production follows customer schedules and is not dated as general availability.

Latest update Oct 9, 2026

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Current status

Commercial HBM4 shipment announced Feb. 12, 2026. Q2 results said HBM4 sales scaled and HBM4E samples shipped. No HBM product image is deployed.

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