Company Overview

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MediaTek

Semiconductors๐Ÿ‡น๐Ÿ‡ฆ๐Ÿ‡ฎ๐Ÿ‡ผ๐Ÿ‡ฆ๐Ÿ‡ณNo. 1, Dusing 1st Rd., Hsinchu Science Park, Hsinchu 30078, TaiwanUpdated 2026-10-06

A Hsinchu fabless designer

MediaTek describes itself as a fabless semiconductor company, TWSE: 2454, founded in 1997. It says it powers more than 2 billion connected devices a year.

On its about page it calls itself the world's fifth largest global fabless semiconductor company. That ranking is the company's own description.

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Quarter ended June 30, 2026

Unaudited consolidated revenue was NT$152,183 million, up 2.0% from the prior quarter and 1.2% from a year earlier. Gross margin was 46.2%. Operating income was NT$22,868 million. Net income was NT$24,605 million. Earnings per share were NT$15.28. The average rate was NT$31.6 per U.S. dollar, and the result is left in New Taiwan dollars.

Rick Tsai said revenue beat the high end of company guidance, mainly on Smart Edge Platforms. Third-quarter guidance was NT$152.2 billion to NT$159.8 billion of revenue and gross margin of 46% plus or minus 1.5 points, at a forecast NT$32 per U.S. dollar. That guidance is not a result.

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Phones were the smaller half

Mobile phones were 41% of the quarter and fell 14% from the prior quarter and 20% from a year earlier. The company pointed to weaker demand as smartphone component costs rose, and it still expected global smartphone unit shipments to fall about 15% for the year.

Smart Edge Platforms were 53% and grew 19% from the prior quarter and 26% from a year earlier. Power IC was 6% and grew 11% from the prior quarter.

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Data center is still a forecast

Tsai said MediaTek had built a first AI accelerator ASIC with a large U.S. cloud customer, with production scheduled for the fourth quarter of 2026. He expected data-center revenue above $2 billion in 2026 and raised a 2027 share target to 15% to 20% of an $80 billion serviceable market. The customer and the chip are unnamed. None of that is recognized revenue for the June quarter.

A second ASIC was described as on track for high-volume production in 2028.

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Dimensity 9600 Pro

On September 15, 2026 MediaTek announced the Dimensity 9600 Pro as a 2nm flagship phone chip. The stated CPU is two C2-Ultra cores up to 4.55 GHz, three C2-Pro cores at 4.35 GHz, and three C2-Pro cores at 3.1 GHz. The first 9600 Pro and 9600M phones were expected that quarter.

The release's speed and power claims, including a 61% cut in multi-core power, come from MediaTek lab demos. This page does not record a later confirmation that phones had shipped.

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