TSMC books US CoWoS interposers from GlobalFoundries

On Oct. 8, 2026 GlobalFoundries announced a manufacturing agreement with TSMC under which GF will supply silicon interposers for TSMC's CoWoS advanced-packaging ecosystem from its Malta, New York, fab. GF called the arrangement a multi-year $2 billion agreement with an initial five-year term and said volume production is expected to ramp in the first half of 2028, establishing a U.S. source of silicon interposers including embedded deep-trench-capacitor parts. Planned wafer volumes and a matching TSMC newsroom confirmation were not in the pages opened for this check.