Nvidia said on Oct. 21 that substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron are planned to raise substrate capacity for its products 2.5 times over three years. The same release describes a $1.1 billion capacity-reservation advance to KYEC for new U.S. test facilities, with high-volume production targeted for April 2027, and an Amkor plan to raise interposer wafer capacity by more than 300 percent by the end of 2028. Nvidia said the IBIDEN advance follows an agreement announced earlier this year, and it labeled the capacity figures as forward-looking plans.
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