Xintec told the Taiwan exchange on Nov. 13 that its board approved a capacity-outsourcing agreement with TSMC, running through Dec. 31, 2033, to build and operate an advanced-packaging backend line in a TSMC plant at the Central Taiwan Science Park. The filing says the line will make oS modules, targets first-phase volume production in 2029, and that the board approved NT$15 billion of convertible bonds for the initial equipment. Taiwan News calls the work the on-substrate step of CoWoS. TSMC has not issued its own statement, and the filing gives no capacity.
/ Sources
/ About this story
Compiled by Venture Atlas from the sources above, using automated AI-assisted research. This is a summary of reporting published elsewhere, not original reporting - follow the source links for the full account. See our editorial standards.
Something wrong here? Email apostructura@gmail.com and we will fix it.
/ Related
- TSMC says employee data appeared on an outside websiteSunday, November 15, 2026
- TSMC reports October revenue of NT$586.89 billionWednesday, November 11, 2026
- Anthropic files a $70 to $78 IPO range and a $26 billion placementTuesday, November 10, 2026
- TSMC approves about $40.9 billion and two AI investment ceilingsTuesday, November 10, 2026