Samsung and SK Hynix set 2028 High-NA DRAM dates

Reuters reported September 14 that Samsung and SK Hynix have both set 2028 dates to begin High-NA EUV DRAM production, while Micron has ordered tools without a production date. TSMC remains committed to High-NA high-volume manufacturing from 2030, and Intel has processed more than one million High-NA wafers across certification, R&D and select Panther Lake layers. ASML CEO Christophe Fouquet said the AI boom is not over and that memory makers are more aggressive on High-NA as low-NA EUV tools are all but sold out through 2027.