Find X10 Pro Max

Find X9 Ultra

OPPO Find X9 Ultra, model CPH2841, in Canyon Orange and Tundra Umber. About 163.16 by 76.97 mm. Thickness about 8.65 mm in Canyon Orange and 9.10 mm in Tundra Umber. Weight about 235 grams or 236 grams by color. Memory options are 12GB plus 512GB and 16GB plus 1TB, with LPDDR5X and UFS 4.1. The display is 6.82 inches, 3168 by 1440, 510 ppi, from 1 to 120 Hz, with 144 Hz in some games. Rear cameras include a 50MP ultra-wide at f/2.0, a 200MP wide camera at f/1.5, a 200MP telephoto at f/2.2, a 50MP ultra telephoto at f/3.5, and a 3.2MP monochrome camera. The front camera is 50MP at f/2.4. Chip is Snapdragon 8 Elite Gen 5. Battery is 7050 mAh typical (26.23 Wh), with adapter power up to 100W and 50W AIRVOOC. ColorOS 16.0. No official price or announcement date is on this specs page.

Reno16 Pro

OPPO Reno16 Pro 5G, model CPH2863, in Starlight Black and Pop White. About 151.21 by 72.42 mm. Thickness about 8.20 mm in Starlight Black and 8.36 mm in Pop White. Weight about 188 grams or 191 grams by color. Memory is 12GB plus 256GB or 512GB. The display is 6.32 inches, 2640 by 1216, up to 144 Hz in some games. Cameras include a 50MP ultra-wide at f/2.0, a 200MP wide camera at f/1.8, a 50MP telephoto at f/2.8, and a 50MP front camera at f/2.0. Chip is Dimensity 8550 SUPER. Battery is 6700 mAh typical (24.93 Wh), with up to 80W SUPERVOOC. ColorOS 16.0. No official price or announcement date is on the specs page.

Find X10

OPPO Find X10, announced for a global debut on 21 October 2026 in Mallorca. Colors named in the 8 October announcement are Glacier Blue, Glow Coral and Mist Grey. That announcement says it uses a dual 200MP camera system co-developed with Hasselblad, the MediaTek Dimensity 9600M, an 8,000mAh silicon-carbon battery, and ColorOS 17. Both 200MP cameras are described as supporting 4K 120fps and 8K 30fps video. No price and no full specification sheet were on the announcement.

Galaxy S26 Ultra

Samsung Electronics

Samsung's Galaxy S26 Ultra, from the global newsroom specification table. Display is 6.9 inches in the full rectangle and 6.7 inches accounting for rounded corners, QHD+ Dynamic AMOLED 2X, 1 to 120 Hz. Body 78.1 by 163.6 by 7.9 mm, 214 grams. Cameras: 50MP ultra-wide at F1.9, 200MP wide at F1.4, 50MP telephoto with 5x optical zoom and 10x optical-quality zoom at F2.9, 10MP 3x telephoto at F2.4, and a 12MP front camera at F2.2. Processor is Snapdragon 8 Elite Gen 5 for Galaxy. Memory options include 16GB with 1TB, 12GB with 512GB, and 12GB with 256GB. Battery is 5,000 mAh typical, rated minimum 4,855 mAh. Wired charging reaches about 75 percent in about 30 minutes with a 60W adapter. Colors include Cobalt Violet, White, Black, and Sky Blue. The announcement highlights a built-in Privacy Display. No dollar price is in the article.

Galaxy Z Fold8

Samsung Electronics

Samsung's Galaxy Z Fold8. The newsroom says that at 201 grams it is the lightest Galaxy Z Fold yet, with the Snapdragon 8 Elite Gen 5 Mobile Platform for Galaxy and a 4,800 mAh battery. The main screen is a 7.6-inch QXGA+ Dynamic AMOLED 2X, 1848 by 2448, 403 ppi, 1 to 120 Hz. The cover screen is 5.5 inches in the full rectangle and 5.4 inches accounting for rounded corners, 1248 by 1972, 428 ppi. Folded size is 81.9 by 123.9 by 9.7 mm. Unfolded size is 161.4 by 123.9 by 4.5 mm, and the unfolded thickness excludes the main-screen frame. Rated battery capacity is 4,660 mAh. Colors on the page include Graphite, Cream, and Lavender for Fold8. Rear cameras in the Fold8 table are a 50MP wide and a 50MP ultra-wide.

Galaxy Z Flip8

Samsung Electronics

Samsung's Galaxy Z Flip8, from the July 22, 2026 newsroom announcement and the August 6, 2026 worldwide sales note. The announcement says it is Samsung's slimmest and lightest Flip, 180 g and 6.1 mm thick, with a 50 MP camera and a reimagined FlexWindow cover screen. Colors on the announcement include Graphite, Cream and Pink, with Mint as a Samsung.com exclusive. No dollar price is in those pages.

HBM4

Samsung Electronics

Samsung's sixth-generation high-bandwidth memory. The Feb. 12, 2026 newsroom says mass production has begun and commercial products have shipped. Typical pin speed 11.7 Gbps, up to 13 Gbps; up to 3.3 TB/s per stack; 12-layer stacks from 24 GB to 36 GB, using 1c DRAM and a 4nm logic base die. HBM4E 12-layer samples began shipping May 29, 2026 at 14 Gbps typical (up to 16 Gbps) and 48 GB; mass production follows customer schedules and is not dated as general availability.