TSMC reportedly developing EMIB-like chip packaging to rival Intel

TSMC is reportedly developing a silicon-bridge advanced packaging technology similar to Intel's EMIB, working with Taiwanese substrate maker Kinsus Interconnect Technology, as an alternative to its capacity-constrained CoWoS-L process, which carries lead times of 52 to 78 weeks. The report, first published by The Information around July 30, 2026, sent TSMC shares up roughly 7% and Intel shares up about 12% the same day, with Nvidia reportedly evaluating the approach for a future Feynman-generation processor; no commercial timeline has been disclosed.