Custom AI XPUs

Overview

Broadcom's custom ASIC / XPU franchise co-designs accelerators with hyperscalers and frontier labs: Google TPUs (every generation since the program began, now contracted through 2031), Meta MTIA (extended through 2029, including a 2nm device), OpenAI Jalapeno (LLM-inference chip taped out in nine months), and Anthropic capacity on Google TPU Ironwood and TPU v8i. Broadcom owns the silicon implementation, HBM PHY, SerDes/network I/O, and 3.5D XDSiP face-to-face packaging; TSMC and, under a July 2026 MOU, Samsung manufacture. Q3 FY2026 XPU shipments grew more than 3.5x year over year and were 73% of AI semiconductor revenue.

Ironwood TPU v7 in high volume to Anthropic and Google; TPU v8i in initial production for Google; Jalapeno first-generation units shipping; next OpenAI XPU approaching tape-out

Key Specs

Q3 FY2026 AI semiconductor revenue

$16.7B (+221% YoY); XPUs 73% of that

OpenAI Jalapeno 2027 deployment

1.3 GW planned in 2027 as part of the 10 GW through-2029 collaboration

Anthropic TPU capacity

1 GW Ironwood in 2026, 5 GW TPU v8i in 2027, incremental 10 GW in 2028 (management outlook)