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Custom AI XPUs
Broadcom's custom ASIC / XPU franchise co-designs accelerators with hyperscalers and frontier labs: Google TPUs (every generation since the program began, now contracted through 2031), Meta MTIA (extended through 2029, including a 2nm device), OpenAI Jalapeno (LLM-inference chip taped out in nine months), and Anthropic capacity on Google TPU Ironwood and TPU v8i. Broadcom owns the silicon implementation, HBM PHY, SerDes/network I/O, and 3.5D XDSiP face-to-face packaging; TSMC and, under a July 2026 MOU, Samsung manufacture. Q3 FY2026 XPU shipments grew more than 3.5x year over year and were 73% of AI semiconductor revenue.
