Wi-Fi 8

Overview

Broadcom's first full Wi-Fi 8 (IEEE 802.11bn / Ultra High Reliability) silicon ecosystem for residential gateways, enterprise access points, and client devices. Flagship parts include the BCM6719 4x4+4x4 dual-band AP chip, BCM4918 AI-ready network processor with an on-die Neural Engine, and May 2026 integrated SoCs (BCM6772/6774/6776) for mesh and multi-gigabit routers. A May 2026 collaboration with Samsung puts Broadcom Wi-Fi 8 alongside Samsung 5G modems for fixed-wireless access. Combined with RF front-ends, this line is the core of the Apple wireless relationship extended through 2031.

Wi-Fi 8 silicon shipping/sampling across residential, enterprise, and FWA; Apple custom wireless and RF extended through 2031

Key Specs

Flagship AP chip

BCM6719 4x4 2.4 GHz + 4x4 5 GHz Wi-Fi 8

Apple wireless partnership

Custom chips and RF through 2031; Apple cites >$30B US manufacturing including a $1.5B Fort Collins expansion