Tomahawk 6

Custom AI XPUs

Broadcom's custom ASIC / XPU franchise co-designs accelerators with hyperscalers and frontier labs: Google TPUs (every generation since the program began, now contracted through 2031), Meta MTIA (extended through 2029, including a 2nm device), OpenAI Jalapeno (LLM-inference chip taped out in nine months), and Anthropic capacity on Google TPU Ironwood and TPU v8i. Broadcom owns the silicon implementation, HBM PHY, SerDes/network I/O, and 3.5D XDSiP face-to-face packaging; TSMC and, under a July 2026 MOU, Samsung manufacture. Q3 FY2026 XPU shipments grew more than 3.5x year over year and were 73% of AI semiconductor revenue.

Thor Ultra

Industry's first 800G AI Ethernet NIC fully compliant with Ultra Ethernet Consortium 1.0, introduced October 14, 2025. Clean-sheet RDMA design (not a dual-400G bond) with packet-level multipathing, out-of-order placement into XPU memory, hardware SACK, programmable congestion control, PCIe Gen 6 x16, and line-rate PSP encryption. Ships as P1800GO (PCIe) and N1800GO (OCP 3.0) 800GbE adapters. Paired with Tomahawk 6, Tomahawk Ultra, Jericho 4, and Scale-Up Ethernet as Broadcom's open Ethernet alternative to proprietary GPU-scale fabrics.

VMware Cloud Foundation

Broadcom's private-cloud software platform, inherited in the November 2023 VMware deal and now the core of infrastructure-software revenue. VCF 9.0 shipped in 2025; VCF 9.1 (May 2026) added production-AI features (memory tiering, storage dedupe, multi-accelerator GPU choice). At VMware Explore 2026 Broadcom layered VMware Private AI Cloud and VMware AI Factory on VCF for on-prem inference and agentic apps, plus AgentMinder for agent governance. VMware ARR was still growing about 15% in Q3 FY2026. EU cloud providers (CISPE) filed a March 2026 complaint alleging post-acquisition licensing abuses.

Wi-Fi 8

Broadcom's first full Wi-Fi 8 (IEEE 802.11bn / Ultra High Reliability) silicon ecosystem for residential gateways, enterprise access points, and client devices. Flagship parts include the BCM6719 4x4+4x4 dual-band AP chip, BCM4918 AI-ready network processor with an on-die Neural Engine, and May 2026 integrated SoCs (BCM6772/6774/6776) for mesh and multi-gigabit routers. A May 2026 collaboration with Samsung puts Broadcom Wi-Fi 8 alongside Samsung 5G modems for fixed-wireless access. Combined with RF front-ends, this line is the core of the Apple wireless relationship extended through 2031.

Falcon 9

SpaceX

Partially reusable two-stage medium-lift launch vehicle. The world's most frequently launched orbital rocket.

Falcon Heavy

SpaceX

Heavy-lift launch vehicle consisting of a strengthened Falcon 9 core with two additional boosters.

Dragon

SpaceX

Reusable spacecraft for cargo and crew transport to the International Space Station.

Starship

SpaceX

Fully reusable super-heavy-lift launch system designed for missions to the Moon, Mars, and beyond. V3 (Block 3) variant with Raptor 3 engines is the production version.