Tomahawk 6

Overview

World's first 102.4 Tbps Ethernet switch chip (BCM78910 series), implemented in 3nm, with 512 x 200GbE or 1,024 x 100G SerDes, Cognitive Routing 2.0, and a co-packaged-optics variant (TH6-Davisson) using TSMC COUPE optical engines. Built for AI scale-up (512 XPUs in one domain) and two-tier scale-out (100,000-plus XPUs). Volume production was confirmed in March 2026 after first shipments in June 2025. AI networking, of which Tomahawk is the flagship, was almost 40% of Broadcom's AI semiconductor revenue in Q2 FY2026 and more than 2.5x year over year in Q3.

Shipping in production volume since March 2026; Davisson CPO variant shipping; used in Jalapeno scale-up/scale-out fabrics

Key Specs

Switching capacity

102.4 Tb/s on a single chip

AI cluster scale

512 XPUs scale-up; 100,000+ XPUs in a two-tier 200 Gbps scale-out

Process

3nm; 100G or 200G PAM4 SerDes; CPO option