Broadcom

PublicFounded 1961🇺🇸Palo Alto, CaliforniaCEO Hock Tan

Broadcom Inc. is a Palo Alto semiconductor and infrastructure-software company whose legal lineage runs from Hewlett-Packard's 1961 semiconductor group through Avago Technologies to the 2016 takeover of Broadcom Corporation.

Semiconductors

Latest update Oct 5, 2026

Overview

Under CEO Hock Tan it is now the leading merchant designer of custom AI accelerators (XPUs) and AI Ethernet silicon for hyperscalers and frontier labs, while VMware, Symantec enterprise security, and mainframe software make up a high-margin infrastructure-software segment. Fiscal 2025 revenue was $63.9 billion (+24%), with AI semiconductor sales of $20.2 billion. The AI ramp then steepened: Q3 FY2026 (ended August 2, 2026) delivered record revenue of $29.6 billion (+86% YoY), including $16.7 billion of AI semiconductors (+221% YoY, +54% QoQ) across six XPU customers. Management raised FY2026 AI semiconductor guidance to $58 billion and said it has secured supply to roughly double that to $115 billion in FY2027 and again to $230 billion in FY2028, with Anthropic on track to become the largest XPU customer in 2027 on Google TPU Ironwood and TPU v8i, OpenAI's Jalapeno inference chip targeting 1.3 GW in 2027, and Google TPU plus networking locked through 2031. Q4 FY2026 is guided to about $34.8 billion of total revenue and $21.7 billion of AI semiconductors. The stock closed September 17, 2026 at $347.30, a market cap of about $1.66 trillion, well below the April 2026 $2 trillion print after several post-earnings selloffs on guidance that beat history but not the most aggressive estimates. Non-AI chips (Apple wireless and RF through 2031, broadband, storage) and VMware remain large, while a March 2026 CISPE complaint keeps EU scrutiny on VMware licensing.

investors.broadcom.comUpdated Sep 18, 2026

What's next9

All milestones

2026
Start AST Singapore high-volume FC-BGA substrate production for Broadcom XPUs
TargetLater 2026 / FY2027
straitstimes.com
H2 2026+
Convert the $200 billion Samsung MOU into a definitive supply contract
The July 25, 2026 Samsung memorandum covers HBM4/HBM4E, 2nm-and-below foundry, and advanced packaging through 2030 and is estimated at more than $200 billion. It is an MOU, not a signed purchase contract. Watch conversion to binding wafers, HBM, and packaging capacity, which would diversify Broadcom away from a TSMC-only XPU supply chain.
cnbc.com
Late 2026
Tape out OpenAI's next-generation XPU beyond Jalapeno
On the September 2, 2026 call Tan said Broadcom and OpenAI are deep in development of the successor to Jalapeno and that it is approaching tape-out, with a third generation already in development. Jalapeno itself is on track for 1.3 GW in 2027 and more than 5 GW of Jalapeno plus successor in 2028.
fool.com
Q4 FY2026
Deliver Q4 FY2026 AI semiconductor revenue of $21.7 billion
TargetQ4 FY2026 (ended Nov 1, 2026)
Hock Tan guided Q4 FY2026 (ended November 1, 2026) AI semiconductor revenue to $21.7 billion, up 236% year over year, and total revenue to about $34.8 billion. That print is the near-term test of whether the Q3 XPU and networking ramp is still accelerating. Watch the mix of XPUs vs AI networking and whether non-GAAP operating margin holds near 66%.
investors.broadcom.com
May 3, 2027
Stand up VMware Explore 2027 and the Private AI Cloud stack
VMware Explore 2027 moves to May 3-6, 2027 at Resorts World Las Vegas. Between now and then the test is whether Private AI Cloud, AI Factory, and AgentMinder turn into production enterprise deployments on VCF 9.1 rather than conference branding, and whether EU review of VMware cloud-provider licensing changes the software growth rate.
broadcom.com

Latest news4

All news

Oct 22026
Broadcom may lend Anthropic $42B for TPU infrastructure
Reuters, citing Anthropic's IPO prospectus, reported on Oct. 1 that Broadcom has agreed to lend Anthropic up to $42 billion to finance infrastructure, with convertible notes that could fund about a third of a $125.2 billion five-year TPU lease. Anthropic said it does not expect notes to be sold before the IPO and warned of potential conflicts from Broadcom acting as both hardware supplier and financier. Broadcom and Anthropic declined comment; a public EDGAR S-1 was not opened for this report.
www.reuters.com www.cnbc.com + Anthropic
Sep 292026
Broadcom-Toppan AST plant opens in Singapore
Advanced Substrate Technologies, a Broadcom and Toppan Holdings joint venture, said it officially opened Singapore's first high-end FC-BGA substrate factory on September 29. Nikkei reported the Pesawat Drive plant opened months ahead of schedule, with Broadcom's Charlie Kawwas hosting Deputy Prime Minister Gan Kim Yong. The site is Toppan's first FC-BGA factory outside Japan; today's opening is not the same as Broadcom's previously guided FY2027 substrate production ramp.
www.broadcom.com asia.nikkei.com ast-sg.com
Aug 272026
OpenAI's Jalapeno chip beats Nvidia in first benchmarks
OpenAI and Broadcom presented Jalapeno's first performance results at the Hot Chips conference on August 25, showing 1.5 to 1.9 times higher throughput per kilowatt and up to 3.6 times lower latency than Nvidia's GB200 and GB300 rack systems on the public InferenceX benchmark. TSMC manufactures the chip and Celestica builds the boards and racks, with small-scale deployment planned by the end of 2026 and a larger rollout in 2027.
OpenAI TechCrunch + OpenAI
Aug 92026
TSMC pulls forward 3nm output, accelerates 2nm ramp
TSMC is on track to reach 180,000 3nm wafers per month by early Q4 2026, two to three months ahead of its prior schedule, on strong demand from customers including Nvidia, AMD and Broadcom, according to an early-August 2026 TrendForce report. The company also expects 2nm capacity to reach 100,000 wafers a month by year end, building on the record $60-64 billion 2026 capital spending guidance it raised in July.
TrendForce Tech Times + TSMC + AMD

Products6

Key metrics

Employees: approximately 33,000 (as of Nov 2, 2025)
Est. annual revenue: $63.89B in FY2025; (ended Nov 2, 2025, +24% YoY; GAAP net income $23.13B). Q3 FY2026 added $29.59B. Three-quarter FY2026 revenue is already $71.09B; Q4 guided to about $34.8B implies roughly $106B for full FY2026 if the guide holds
Market cap: about $1.66T; (Sep 17, 2026 close; AVGO $347.30). 52-week high $495.00, low $289.96. Hit $2T in April 2026, the sixth company ever to do so
Latest quarterly revenue: $29.59B; (Q3 FY2026, ended Aug 2, 2026, +86% YoY). Q4 guided to about $34.8B (+93% YoY). YTD three-quarter revenue $71.09B
AI semiconductor revenue: $16.7B in Q3 FY2026; (+221% YoY, +54% QoQ; 56% of total revenue). XPU shipments >3.5x YoY and 73% of AI revenue; AI networking >2.5x YoY. Q4 AI guided to $21.7B (+236% YoY). FY2026 AI guided to $58B (+186% YoY)
AI revenue outlook: about $115B in FY2027 and $230B in FY2028, on supply Tan said is already secured; demand 'exceeds' the FY2027 figure. Target to exceed $30 of EPS in FY2028
XPU customers: Six custom-accelerator customers; Named deployments include Google TPU (through 2031), Anthropic (largest XPU customer expected in 2027-2028; 1 GW Ironwood in 2026, 5 GW TPU v8i in 2027, incremental 10 GW in 2028), OpenAI Jalapeno (1.3 GW in 2027; >5 GW Jalapeno plus successor in 2028), and Meta MTIA (through 2029)
Free cash flow: Q3 FY2026 record $13.7B; (46% of revenue); cash and equivalents $24.0B at quarter-end. FY2025 free cash flow $26.9B
Non-GAAP operating margin: about 66% in Q3 FY2026; (non-GAAP operating income $20.1B); Q4 guided to about 66% of projected revenue
R&D: $11B invested in R&D in FY2025; about 74% of the workforce in R&D and operations; about 19,000 patents
Employees: approximately 33,000 worldwide as of November 2, 2025 (FY2025 10-K). About 57% in R&D roles; 49% in North America, 36% Asia, 15% EMEA. Voluntary attrition about 4.1% in FY2025
Market cap (Sept 23, 2026 session): about $1.69T; (AVGO last $354.99 mid/late session). Prior record used Sept 17 close $347.30 / about $1.66T
Market cap (Sept 29, 2026 close): about $1.70T; (AVGO close $355.10). 52-week high $495.00, low $289.96.
AST Singapore FC-BGA status: Officially opened Sept 29, 2026; (95,000 sq m; TOPPAN lists 315 staff at end-September). TOPPAN's 30 Sept plant table lists Operation Start December 2026. AST/EDB still target high-value manufacturing by late-2026; Straits Times quotes AST saying high-volume manufacturing begins later in 2026. No named first Broadcom XPU substrate shipment or utilization figure. Tan dated Broadcom substrate deployment to FY2027.
Anthropic convertible-note facility: Up to $42B of convertible promissory notes for compute-lease obligations. Broadcom Q3 FY2026 10-Q Note 10: unnamed customer may issue notes; none issued as of Aug 2, 2026. CNBC/Reuters say Anthropic's prospectus sizes the notes at about a third of a $125.2B five-year TPU lease and flags supplier-lender conflicts. Broadcom did not comment.

Operations & revenue

Operating status

Operational; Anthropic $42B facility in prospectus, unnamed in 10-Q

Reuters/CNBC reported Oct 1 that Anthropic's IPO prospectus names Broadcom as lender of up to $42B in convertible notes for infrastructure, covering about a third of a $125.2B five-year TPU lease. Broadcom did not comment; a public EDGAR S-1 was not opened. Broadcom's own Q3 FY2026 10-Q Note 10 (filed Sept 10) already discloses that an unnamed customer may issue up to $42B of convertible promissory notes for compute-lease obligations, with none issued as of Aug 2, 2026, plus a separate about $29B undiscounted AI-rack lease backstop on which Broadcom has paid nothing. TOPPAN's 30 Sept plant table lists AST Singapore Operation Start December 2026; AST/EDB still target high-value manufacturing by late-2026 and Straits Times quotes high-volume manufacturing later in 2026. No named first Broadcom XPU substrate shipment. Q3 FY2026 $29.6B revenue print unchanged.

Revenue streams

AI semiconductors (XPUs + AI networking)
Custom AI accelerators co-designed with hyperscalers and frontier labs (Google TPU, Meta MTIA, OpenAI Jalapeno, Anthropic TPU capacity) plus AI Ethernet switches, NICs, SerDes, and optics. $16.7B in Q3 FY2026 (73% XPU / remainder networking); FY2026 guided to $58B. This is now the company's growth engine and more than half of quarterly sales.
Non-AI semiconductors (wireless, broadband, storage)
RF front-ends, Wi-Fi/Bluetooth, broadband/PON, Fibre Channel and server-storage controllers. Apple is a multi-year wireless and custom-ASIC customer through 2031. Q3 FY2026 non-AI semiconductor revenue was about $4.2B (+5% YoY, flat QoQ), with broadband and storage offsetting weaker wireless.
Infrastructure software (VMware, Symantec, CA/mainframe)
VMware Cloud Foundation and related private-cloud software, Symantec enterprise security, and CA mainframe and enterprise tools. Q3 FY2026 infrastructure-software revenue was $8.75B (+29% YoY), 30% of sales, with VMware sustaining about 15% ARR growth. Gross margins in this segment remain in the low-90s on a non-GAAP basis. EU cloud providers have complained about post-acquisition VMware licensing.

Track record

How past announced dates turned out.

3/3announced dates hit on time

3 Hit
0 Slipped
0 Missed

Hit
Ship OpenAI Jalapeno first-generation units
Target H2 2026 · Resolved Aug 2, 2026
On the September 2, 2026 Q3 call, management said first-generation Jalapeno units had shipped in the quarter ended August 2, 2026. Gigawatt-scale deployment (1.3 GW in 2027) remains an upcoming step.
Original target Outcome
Hit
Cross a $2 trillion market cap
Target 2026 · Resolved Apr 1, 2026
Broadcom crossed $1 trillion in December 2024 and $2 trillion in April 2026, the sixth company to do so. The stock later gave back a large part of that gain; it closed September 17, 2026 at $347.30, about $1.66 trillion.
Original target Outcome
Hit
Close the VMware acquisition
Target 2023 · Resolved Nov 22, 2023
Broadcom completed the cash-and-stock acquisition of VMware on November 22, 2023 after global antitrust review, then moved headquarters to VMware's Palo Alto campus. VMware is now the core of the infrastructure-software segment.
Original target Outcome

Timeline25

2026
1. Agreed to lend Anthropic up to $42B, prospectus says
  Reuters reported Oct. 1, 2026 that Anthropic's IPO prospectus says Broadcom has agreed to lend Anthropic up to $42 billion to finance infrastructure, with convertible notes that could cover about a third of a $125.2 billion five-year TPU lease. Broadcom did not comment. Anthropic is still described as becoming Broadcom's largest compute customer in 2027.
2. AST Singapore FC-BGA plant officially opens
  Advanced Substrate Technologies, the Broadcom and Toppan Holdings joint venture, announced the official opening of its Singapore factory on September 29, 2026, calling it the first site in the country able to make high-end FC-BGA substrates and Toppan's first such plant outside Japan. Nikkei said the opening was months ahead of schedule and that Broadcom Semiconductor Solutions president Charlie Kawwas hosted Deputy Prime Minister Gan Kim Yong. AST lists the plant at 9 Pesawat Drive. This is a factory opening, not a sourced start of Broadcom's FY2027 substrate production ramp.
3. FT reports China SASAC survey of Broadcom switches in state data centers
  The Financial Times reported that China's SASAC had surveyed Broadcom switch use in state-backed data centers and that some sites could be as much as 90% Broadcom, with possible later informal guidance to favor domestic vendors. Reuters published the report on September 23 and said it could not independently verify it; Broadcom and SASAC were not immediately reached. This is a reported review, not a ban, and private-cloud hyperscaler demand is a separate question.
4. Tapes out Tomahawk 7, a 200 Tbps Ethernet switch
  On the September 2 Q3 FY2026 call, Hock Tan said Broadcom had just taped out Tomahawk 7, which he called the industry's first 200 Tbps Ethernet switch, after Tomahawk 6 (102.4 Tbps) already shipping in production volume since March 12, 2026. There is still no standalone Tomahawk 7 product announcement. Secondary reporting has described an unannounced 204.8 Tbps, 400G-SerDes design; that figure is not in the prepared remarks.
5. Hock Tan defends the $230 billion FY2028 AI outlook after an AI-pacing scare
  On September 15, 2026, after Anthropic CEO Dario Amodei's 'pace the frontier' essay rattled AI-infrastructure stocks (AVGO -4.8% that day), Tan tells CNBC Mad Money that demand for training and inference compute remains strong and durable and that the FY2027 $115 billion and FY2028 $230 billion AI semiconductor projections are intact. He also says Anthropic is positioned to surpass other custom-chip buyers at Broadcom by 2027.
6. VMware Explore: Private AI Cloud, AI Factory, and AgentMinder
  At VMware Explore 2026 (August 31-September 3, Las Vegas), Broadcom launches VMware Private AI Cloud and VMware AI Factory on Cloud Foundation 9, plus AgentMinder for AI-agent governance. It also sets VMware Explore 2027 for May 3-6, 2027 at Resorts World Las Vegas.
7. Q3 FY2026: $29.6 billion revenue, $16.7 billion AI semiconductors
  On September 2, 2026 Broadcom reports Q3 FY2026 (ended August 2) revenue of $29.59 billion (+86% YoY), semiconductor solutions $20.84 billion (+127%), infrastructure software $8.75 billion (+29%), and AI semiconductor revenue of $16.7 billion (+221% YoY, +54% QoQ). GAAP net income is $13.09 billion; free cash flow is a record $13.7 billion (46% of revenue). Hock Tan guides Q4 AI semiconductors to $21.7 billion and FY2026 AI to $58 billion, with FY2027/FY2028 AI outlook of about $115 billion and $230 billion on secured supply. Shares still sell off on the print, a now-familiar pattern of extraordinary numbers missing the most aggressive estimates.
8. Signs a $200 billion Samsung foundry, HBM, and packaging MOU
  On July 25, 2026 Samsung Electronics and Broadcom sign a memorandum of understanding they estimate at more than $200 billion through 2030, covering HBM4/HBM4E memory, 2nm-and-below foundry, and 2.3D/2.5D advanced packaging for Broadcom AI accelerators. The MOU is not yet a definitive supply contract.

2026
1. Extends Apple custom-chip partnership through 2031
  On July 6, 2026 Broadcom says it will develop and supply custom semiconductor products to Apple through 2031. Apple later frames the US manufacturing piece as more than $30 billion, with Broadcom investing $1.5 billion to expand its Fort Collins, Colorado RF and wireless plant, covering FBAR filters, Wi-Fi, Bluetooth, and other networking silicon used across Apple devices.
2. Unveils OpenAI Jalapeno inference chip after a nine-month design
  On June 24, 2026 OpenAI and Broadcom unveil Jalapeno, OpenAI's first custom intelligence processor for LLM inference, designed to tape-out in nine months with Broadcom silicon implementation, Tomahawk networking, and Celestica boards and racks. Engineering samples run GPT-class workloads; gigawatt-scale deployment is planned with partners through 2029.
3. Apollo and Blackstone back a 20-plus GW AI XPV platform
  On June 9, 2026 Broadcom, Apollo, and Blackstone launch the AI XPV Platform to finance more than 20 GW of XPU and networking deployments for frontier labs through 2028. It opens with a $35 billion tranche, led by Apollo with Blackstone, for more than 1 GW of Anthropic capacity at Fluidstack sites from mid-2026.
4. Extends Meta MTIA partnership through 2029
  On April 14, 2026 Broadcom and Meta announce a multi-year, multi-generation partnership for Meta's MTIA custom accelerators through 2029, including a 2nm AI compute accelerator. The initial commitment exceeds 1 GW as the first phase of a multi-gigawatt rollout.
5. Google TPU and networking deal through 2031; Anthropic 3.5 GW
  On April 6, 2026 Broadcom files an 8-K: a long-term agreement to develop and supply Google's future TPU generations plus a supply-assurance deal for networking and other AI-rack components through up to 2031, and an expansion under which Anthropic will access about 3.5 GW of next-generation TPU compute through Broadcom beginning in 2027, contingent on Anthropic's commercial success.
6. Surpasses a $2 trillion market cap
  In April 2026 Broadcom crosses a $2 trillion market capitalization, the sixth company in history to do so, before later giving back a large part of that gain as AI-capex sentiment swung.
2025
1. OpenAI 10 GW custom-accelerator collaboration; Thor Ultra 800G NIC
  On October 13, 2025 OpenAI and Broadcom announce a collaboration to deploy 10 gigawatts of OpenAI-designed AI accelerators, with racks using Broadcom Ethernet, starting in the second half of 2026 and completing by end of 2029. The next day Broadcom introduces Thor Ultra, the first 800G AI Ethernet NIC compliant with the Ultra Ethernet Consortium spec.
2. Ships Tomahawk 6, the first 102.4 Tbps Ethernet switch chip
  On June 3, 2025 Broadcom begins shipping Tomahawk 6, a 3nm 102.4 Tbps Ethernet switch with 100G/200G SerDes and a co-packaged-optics option, aimed at AI scale-up of 512 XPUs and two-tier scale-out of 100,000-plus XPUs.
3. FY2025 revenue hits $63.9 billion; AI semiconductors $20.2 billion
  Fiscal 2025 (ended November 2, 2025) posts record revenue of $63.9 billion (+24%) and GAAP net income of $23.1 billion. Semiconductor solutions contribute $36.9 billion and infrastructure software $27.0 billion. AI semiconductor revenue grows 65% to $20.2 billion. Year-end headcount is about 33,000.
2024
1. Crosses a $1 trillion market cap
  In December 2024 Broadcom becomes the 12th company to surpass a $1 trillion market capitalization, as AI custom-silicon demand starts to re-rate the stock.
2023
1. Closes $69 billion VMware acquisition and moves HQ to Palo Alto
  On November 22, 2023, Broadcom completes its cash-and-stock acquisition of VMware, one of the largest deals in tech, after global antitrust review including China. CEO Hock Tan relocates headquarters from San Jose to VMware's Stanford Research Park campus in Palo Alto.
2019
1. Acquires Symantec's enterprise security business for $10.7 billion
  Broadcom buys Symantec's enterprise security franchise for $10.7 billion in cash and takes the Symantec brand for that business, adding cybersecurity to the infrastructure-software stack.
2018
1. Redomiciles to the US; Qualcomm bid blocked; buys CA Technologies
  Broadcom Limited redomiciles from Singapore to Delaware as Broadcom Inc. The Trump administration blocks its hostile takeover of Qualcomm on CFIUS national-security grounds. In November it closes an $18.9 billion acquisition of mainframe and enterprise-software vendor CA Technologies, the start of a software diversification after the Qualcomm failure.
2016
1. Avago buys Broadcom Corp. for $37 billion and takes the name
  Avago completes its $37 billion acquisition of Irvine-based Broadcom Corporation, forming Broadcom Limited. The Broadcom Corp. ticker BRCM is retired; AVGO becomes the surviving listing.
2009
1. Avago lists on Nasdaq as AVGO
  On August 6, 2009, Avago Technologies completes its IPO on Nasdaq under ticker AVGO, the listing Broadcom Inc. still uses.
2005
1. KKR and Silver Lake buy Agilent's chip group and form Avago
  KKR and Silver Lake Partners acquire Agilent Technologies' Semiconductor Products Group for $2.66 billion and form Avago Technologies, then the world's largest privately held independent semiconductor company.
1961
1. HP Associates founded as Hewlett-Packard's semiconductor group
  The business that became Broadcom Inc. starts as HP Associates, Hewlett-Packard's semiconductor products division, the root the company still cites for more than 60 years of engineering history alongside AT&T/Bell Labs and Lucent.

Funding

$3.1Bdisclosed across 2 rounds with a stated amount

RoundAmountInvestors

PE buyout (Agilent SPG / Avago formation)
2005
$2.66B
KKR, Silver Lake Partners
IPO (Nasdaq: AVGO)
Aug 2009
$400M filed; listed Aug 6, 2009
Public markets (Nasdaq: AVGO)

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Broadcom

Overview

What's next9

Start AST Singapore high-volume FC-BGA substrate production for Broadcom XPUs

Convert the $200 billion Samsung MOU into a definitive supply contract

Tape out OpenAI's next-generation XPU beyond Jalapeno

Deliver Q4 FY2026 AI semiconductor revenue of $21.7 billion

Stand up VMware Explore 2027 and the Private AI Cloud stack

Deploy 1.3 GW of OpenAI Jalapeno in 2027

Scale Anthropic from 1 GW Ironwood to 5 GW of TPU v8i

Print about $115 billion of AI semiconductor revenue in FY2027

Start deploying the Singapore fab for XPU substrates

Latest news4

Broadcom may lend Anthropic $42B for TPU infrastructure

Broadcom-Toppan AST plant opens in Singapore

OpenAI's Jalapeno chip beats Nvidia in first benchmarks

TSMC pulls forward 3nm output, accelerates 2nm ramp

Products6

Custom AI XPUs

Tomahawk 6

Thor Ultra

VMware Cloud Foundation

Wi-Fi 8

Tomahawk 7

Key metrics

Operations & revenue

Revenue streams

Track record

Timeline25

Funding

Overview

What's next9

Start AST Singapore high-volume FC-BGA substrate production for Broadcom XPUs

Convert the $200 billion Samsung MOU into a definitive supply contract

Tape out OpenAI's next-generation XPU beyond Jalapeno

Deliver Q4 FY2026 AI semiconductor revenue of $21.7 billion

Stand up VMware Explore 2027 and the Private AI Cloud stack

Deploy 1.3 GW of OpenAI Jalapeno in 2027

Scale Anthropic from 1 GW Ironwood to 5 GW of TPU v8i

Print about $115 billion of AI semiconductor revenue in FY2027

Start deploying the Singapore fab for XPU substrates

Latest news4

Broadcom may lend Anthropic $42B for TPU infrastructure

Broadcom-Toppan AST plant opens in Singapore

OpenAI's Jalapeno chip beats Nvidia in first benchmarks

TSMC pulls forward 3nm output, accelerates 2nm ramp

Products6

Custom AI XPUs

Tomahawk 6

Thor Ultra

VMware Cloud Foundation

Wi-Fi 8

Tomahawk 7

Key metrics

Operations & revenue

Revenue streams

Track record

Timeline25

Funding

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